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Product
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Description |
Inquiry |
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Dynatex DX-III Scriber/Breaker |
Dynatex DX-III Scriber/Breaker
* Vintage: 1997
* Serial No. S/N 11174
* Windows 95 Operating System* Wafer type: GaAs, LINBo, Glass, InP, Silicon, Quartz ceramic |
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WaferDemount AW 750 |
WaferDemount AW 750,
6 feet long, 3 feet deep, 6 feet high. 1500 Pd (700Kg)
6 deep solvent tanks. 2 with temperature controller from room temperature to 200 degree C, +-3 degree C accuracy.
One N2 gun.
High temperature solvent. (Boiling temperature > 400 degree C)
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Thermocarbon Dicing Saw 8003 |
The Thermocarbon ESEC Dicing Saw 8003 is a high performance, multi-processor, fully programmable, precision wafer dicing saw. Contact sales@allwin21.com for more information. |
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LUMONIC LXTR50 |
Backside Equipment LUMONIC LXTR50 |
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