AW-1008 Plasma Stripper/Asher

Manufacturer: Allwin21
Condition: New
Wafer Size: 3″ – 6″ Capability
Wafer Loading: 3-axis Robot wafer transfer (Video)
Plasma Power: Microwave
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-4 Lines

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Downloads: AW-1008R (PDF)
Gasonics Aura 1000 with solid robotic wafer transfer (optional)

    Allwin21 AW-1000 Features:

    • Designed with III-V Production in Mind.
    • Controller with Touchscreen GUI and PentiumⓇ Grade PC.
    • Allwin21 Advanced Controller Software with PSUM technology to PREVENT MIS-PROCESSING.
    • The 3-axis wafer transport robot (Video) installed:
      • Superior than Gasonics Aura 1000 design that’s synonymous for wafer breakage and constant alarms/errors.
      • INCREASED THROUGHPUT
      • Receive cassette station can be substituted with a Cooling/Alignment station to prevent wafer breakage.
    • NO OBSOLETE PARTS.
    • Closed Loop Temperature Control (CLTC) temperature control for heating wafers up to 350°C  (± 2 – 5°C) using our proprietary RTP technology for BETTER PROCESS REPEATABILITY.
    • BETTER UNIFORMITY by using three 1kW lamps.
    • Option to run two different wafer sizes without any hardware changes.

    Specifications:EOP

    • Downstream Plasma.  <0.1V CV-Shift NO ELECTRICAL DAMAGE to product.
    • Front and Backside isotropic photoresist removal.
    • Bulk Ash/Strip Rate:
      • Positive Photoresist = 2µ – 5µ / min
      • Negative Photoresist = >8µ / min
    • 1000W Microwave Power (1.25kW w/ Variable MW Power option available)
    • Small footprint.  32″w  x  32″d  x  64″h
    • 75mm – 150mm wafer capability.
    • Up to 4 MFC’s.
    • End-of- Process (EOP) process endpoint detection.
    • Pressure control.
    • GEM/SECSII (option).
    • Floor or Through-the-wall design.

    Typical Recipe Parameters:

    • Pressure = 1.75 to 2.5 Torr
    • Microwave = 1000W

    • Gas Flow:
      • 02 4.5 SLPM
      • N2 0.5 SLPM
    • Variable Lamp Time = 0-9999 seconds (AW SW)
    • Variable Temperature = 150°C – 350°C

    Facilities:

    • Vacuum Chamber Pump = 165 cfm
    • Cabinet Exhaust = >250 cfm
    • Plumbed Gases:
      • O2
      • N2
      • Forming Gas for metal wafers. (Optional)
      • Ar – for Metal wafer surface clean. (Optional)
    • Electrical Requirements: 208VAC, 3-Phase, 60Hz, 30Amps
    • Water Cooling only if “Variable MW Power Control” option is installed.
    • Weight = 350lbs.

     

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