The AW-B3000 batch, barrel photoresist asher (Video) is an manual load  tool designed as a flexible 13.56 MHz RF plasma photoresist removal and system for high-volume wafer fabrication. AW-B3000 is in direct response to manufacturer’s concerns for uptime, reliability, production-proven technology. and low cost of ownership.

KEY FEATURES:

• 2 ” to 8 ” substrate.
• Up to three gas lines with three MFC(Customized)
• One New Computer with touch screen.
• One New Controller Box
• One New Touch Screen Monitor with keyboard, mouse.
• One 13.56 MHz ENI RF Generator or Equivalent for up to 1200W
• New Allwin21 Corp proprietary AW software  with PC control for Branson/IPC 3000/2000
• Baratron Gauge to read the pressure to keep the process repeatable 
• Throttle valve to control the pressure to keep the process repeatable

SOFTWARE FEATURES:

• Maintenance, Manual, Semi Automatic and Full Automatic operation modes
• Automated calibration of all subsystems
• Troubleshooting to sub-assembly levels
• Programmed comprehensive calibration and diagnostic functions
• Recipe creation for full automatic wafer processing
• Automatic decline of improper recipes and process data
• Multi level password protections
• Storage of multiple recipes and system functions
• Real-Time process data acquisition,display ,analysis
• Real-Time graphics user display (GUI)
• Process Data and Recipe storage on a hard drive
• GEM/SEC II functions (optional)
• ENI RF Generator instead of the original obsolete RF Generator
• New Controller box instead of the original controller

OPTIONS:

• End of Process (EOP) Detection:
  • Automatically stops the Process after all wafers are fully stripped regardless of their quantity or photoresist thickness.
• Chamber Pre-heat:
  • Allwin21 AW-B3000 Controller uses temperature from sheathed Thermocouple (TC) within chamber to preheat substrates using an N2 Plasma thus increasing the Ash-rate.

Some customers for your reference.

Branson/IPC and related trademarks belongs to Branson/IPC company.

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