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AccuThermo AW610M RTP

ByAtmospheric Rapid Thermal Process, Rapid Thermal Process Equipment

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Type: The most popular , production proven model of Desktop, Atmospheric, Manual Load/Unload RTP RTA RTO RTN.

New Options: Add Double O Ring and/or O2 Sensor/Analyzer for O2 sensitive applications and saving GaAs, InP, GaN, GaInP, SiC and other valuable compound material wafers .

Wafer Size: 2 to 4 inch or 3~6 inch, Silicon wafers. Use 3″/4″/6″ Susceptor or wafer carriers for small samples, compound material (GaAs , InP , GaN , SiC , GaInP , Glass , etc.) wafers and wafers with metal thin film on top during RTP process.

Controller: Allwin21 unique real time precise Advanced PID Control Technology with Fuzzy Logic Learn capability and Chamber Thermal Data. 0.1millisecond Control!

Temperature: Closed-loop temperature control with bare thin 0.010” Dia K type thermocouple (150-840C) and Non-Contact Patented ERP pyrometer (Option,400-1250C) . 0-0.25 second quick response for repeatability and precise control! Typical processes are 400-600C for alloy, 700-950C for titanide, compound materials annealing and 1000-1050C for implant annealing

Lamp Zones: 6 Zones. Bottom and top heating with 21 (1.2KW ea)  Radiation heating lamps. 2400hours-power-on service time! SSR Lamp control instead of  traditional TRIAC control.

Gas Lines: MFCs, 6 lines capability .Typically, Nitrogen (N2), oxygen (O2), argon (Ar), helium (He) , Forming Gases, NH3, N2O2 etc. are used.

Chamber Design: 40-years-proven Heating chamber’s cold-wall design with special scattering gold plating finish ,originated from AG Associates Heatpulse 610.

Installation: Customer-installation design. Local engineer installation is optional.

PowerSum Function: Save valuable compound material wafers.

RTP Main Customers: Link

Free Fast Quote: Link

AG Associates

30 years approved chamber design from AG Associates

Allwin21 RTPs PowerSum Save Valuable Compound Wafers

Some customers link:

  1. The Integrated Nanosystems Research Facility at the University of California, Irvine (INRF UCI)
  2.  Microelectronics Research Center | Department of Electrical and Computer Engineering | The University of Texas at Austin 
  3. Our main customers list

    AG_Std

    Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing tool.

    The AccuThermo AW610M (Video) is a rapid thermal processing (RTP) system, which uses high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled temperatures. The process periods are typically 1‑600 seconds in duration, although periods of up to 9999 seconds can be selected.

    These capabilities, combined with the heating chamber’s cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

    The AccuThermo RTP AW610M rapid thermal annealing system consists of an oven unit and a controller computer running the Allwin21 RTAPRO controller software. The wafer to be processed is placed on a quartz tray that slides into a quartz isolation tube in the oven unit. Four banks of lamps, two above the quartz tube and two below it, provide the source of energy for heating the wafer. The lamps can be controlled manually and automatically from the controller computer.

    The RTAPRO control software allows full control and diagnostics of the AccuThermo RTP system.  In addition, it allows the creation of recipes for automated control of the temperature and, optionally, process gas flow.

    The control software uses a set of operating instructions known as recipes to automatically control the AccuThermo RTP system. These recipes are created by the Process Engineer to monitor and control the parameters of the processing cycle. The Operator then uses the software to select and run the process parameters (steady state temperature, process time, ramp rates, etc.).

    The RTAPRO software is also used to create, delete, copy, modify and store the recipes and to execute system diagnostics.

    AccuThermo AW610M Key Features:

    • Allwin21 unique real time precise Advanced PID Control Technology with Fuzzy Logic Learn capability and Chamber Thermal Data. 0.1millisecond Control!
    • Use PowerSums to save valuable compound wafers, detect the process and increase Yield.
    • 40-years-proven Heating chamber’s cold-wall design with special scattering gold plating finish ,originated from AG Associates Heatpulse 610.
    • Closed-loop temperature control with bare thin 0.010” Dia K type thermocouple (150-840C) and Non-Contact Patented ERP pyrometer (Option,400-1250C) . 0-0.25 second quick response for repeatability and precise control!
    • Elimination of external contamination with isolated quartz tube.
    • Bottom and top heating with 21 (1.2KW ea) Radiation heating lamp module with 6 bank zones ,achieving  superior heating uniformity.
      •  ZONE( 3 ), TOP Front ( 3 ) lamps
      •  ZONE( 4 ), TOP Center ( 4 ) lamps
      •  ZONE( 5 ), TOP Rear ( 3 ) lamps
      •  ZONE( 6 ), BOTTOM Front ( 4 ) lamps
      •  ZONE( 7 ), BOTTOM Center ( 3 ) lamps
      •  ZONE( 8 ), BOTTOM Rear ( 4 ) lamps
    • Precise time-temperature profiles tailored to suit specific process requirements (►).
    • Fast heating and cooling rates unobtainable with conventional technologies.
    • Consistent wafer-to-wafer process cycle repeatability which is the most important characteristic of rapid thermal annealing systems.
    • 24V valves for cooling air and water.
    • Pentium® class computer board inside the equipment with a 17-inch LCD monitor and Allwin21 Corp proprietary software package
    • New type water sensor which is more reliable.
    • SSR Lamp control instead of  triac control.
    • Small footprint and energy efficiency:26(W) X 14(D) X 18(H) inch
    • Software which integrates all of the Process Control into a single reliable software package (►).
      • GUI interface (►).
      • Real-Time process data acquisition (►).
      • Real-Time graphics (►).
      • Process Data Analysis  (►).
      • Process Data and Recipe storage on a hard drive (►).
      • Recipe Editor for Multi-step Processing (►).
      • Easy Recipe Editor (►).
      • System Diagnostics function (►).
      • Chamber calibration data for smooth control (►).
      • Easy software pyrometer calibration (►)
      • Easy software gas calibration (►)
      • Easy software thermocouple calibration (►)
      • Power summary function
      • More IO AD DA hardware exposed for easier maintenance and trouble shooting (►)
      • The watchdog timer shuts down the lamps to prevent run-away heating of the wafer.

    Applications

    The AccuThermo RTP system is a versatile tool that is useful for many applications:

    • Ion Implant Activation
    • Polysilicon Annealing
    • Oxide Reflow
    • Silicide Formation
    • Contact Alloying
    • Oxidation and Nitridation
    • GaAs Processing

    Heating, Cooling, and Temperature Measurement

    The following list contains the key features of the AccuThermo AW 610M RTP system heating, cooling and temperature measurement systems:

    • High-intensity visible radiation heats wafers for short periods of 1 to 9999 seconds at precisely controlled temperatures in the 400°C to 1200°C range. (1 to 600 second heating periods are used typically.)
    • Tungsten halogen lamps and cold heating chamber walls respectively allow fast wafer heating and cooling rates.
    • The system delivers time and temperature profiles tailored to suit specific process requirements.
    • Pyrometer or thermocouple sensing offers precise closed-loop temperature control.
    • Cooling N2 flows around the lamps and quartz isolation tube
    • MFC controlled gases (up to four) flow through the heating chamber for purge and/or process purposes.

     

    AccuThermo AW610M Basic Configuration:

    1. AccuThermo AW610M Main Frame with wires.

    2. Aluminum chamber with water cooling and gold plating.

    3. Isolated Quartz Tube With/without window.

    4. Oven control board and main control board

    5. Bottom and top heating with 21 (1.2 KW ea, TOP 10 lamps, BOTTOM 11 lamps) Radiation heating lamp module with 6 bank zones .

      •  ZONE( 3 ), TOP Front ( 3 ) lamps
      •  ZONE( 4 ), TOP Center ( 4 ) lamps
      •  ZONE( 5 ), TOP Rear ( 3 ) lamps
      •  ZONE( 6 ), BOTTOM Front ( 4 ) lamps
      •  ZONE( 7 ), BOTTOM Center ( 3 ) lamps
      •  ZONE( 8 ), BOTTOM Rear ( 4 ) lamps

    6. Quartz Tray for 2 to 4 inch or 4 to 6 inch round (or square)  wafer

    7. MFCs: 6 gas lines with 1-6 MFCs. Optional.

    8. Computer Board with AW Software, 17” LCD Monitor, Mouse, Standard Keyboard

    9. T Shape Quartz with TC and one Quartz holder for 100-800°C

    10. One package of 5 pieces of thermocouple wires

    11. One USB with original Software backup

    AccuThermo AW610M Options:

    • Items with”*” are not recommended.
    (1) Installation and Training on customer site
    (2) Multiple Process Gases (Up to 6) and MFCs
        1 gas line with 1 MFC and shutt-off valve
        2 gas lines with 2 MFC and shutt-off valves
        3 gas lines with 3 MFC and shutt-off valves
        4 gas lines with 4 MFC and shutt-off valves
        5 gas lines with 5 MFC and shutt-off valves
        6 gas lines with 6 MFC and shutt-off valves
    (3.1) Patented ERP Pyrometer (400-1250°C) as non-contact high temperature sensor
    (3.2) *A5-1006-02 Shielded TC probe assembly and A4-1010-01-SiC Cap for 400-1050°C
    (3.3)* Double O Ring and/or O2 Sensor/Analyzer
    (4) Chiller for ERP Pyrometer
    (5) TC Wafer, Single Point for Pyrometer calibration
        2-inch,Si wafer
        4-inch,Si wafer
        6-inch,Si wafer (Can be used upside down instead of Pyrometer, Special Shield TC with SiC Probe for 400-1050C if it is not used frequently)
    (6) Omega Meter for Pyrometer calibration
    (7) Carrier or Susceptor for small sample, transparent substrate and substrate with metal thin film on top.
        7310-1854-04,Base, 3 inch Susceptor, Graphite with SiC coating.
        7310-1854-05,Cover, 3 inch Susceptor, Graphite with SiC coating
        A4-0015-00,Base, 4 inch Susceptor, Graphite with SiC coating:
        A4-0015-02,Cover,4 inch Susceptor, Graphite with SiC coating
        014-0101,Base, 6 inch Susceptor, Graphite with SiC coating
        014-0102,Cover,6 inch Susceptor, Graphite with SiC coating
        A4-0002-01,Base, 4X2 inch Susceptor, Graphite with SiC coating
        A4-0003-01,Cover,4X2 inch Susceptor, Graphite with SiC coating
        A4-0049-02,Base, 3X3inch Susceptor, Graphite with SiC coating
        A4-0049-01,Cover,3X3 inch Susceptor, Graphite with SiC coating
        * Base, 2 to 5 inch carrier, Si Ingot, 1mm depth pocket, 2mm total
        * 6 inch Si wafer with 2,3,4 inch pocket (200um depth)
        * 3″,4″,6″,4×2″,3×3″,16×2″,5×3″,4×4″ etc. Susceptor, Silica with SiC coating
    (8)*Quartz Tube with Liner Support, 6”,PN: 7310-2842-03
    (9) *Quartz Liner, 6 inch, PN: 7310-3010-02
    (10)*GEM/SEC II for network function
    (11)*Extended warranty: 2nd year;3rd Year.
    (12) *Spare parts
    Item P/N Description Qty
    Spare Kit, Level 1
    1 2451-0010-02 Lamp, 1200W 208V 5
    2 2504-0070 O-Ring, Purge Inlet 2
    3 2504-0160-AW1 O-Ring, Flange to Tube,Door to Flange 4
    4 5101-0030 Fuse,1A 250V,Fst-Blo 2
    5 5101-0090 Fuse,1/2A 250V,Fst-Blo 2
    6 A5-0346 Fuse,10A 250V 2
    Spare Kit, Level 2
    7 2109-0050 Lampholder,Tung Halg,10A 600V 2
    8 A5-0391 Valve Solenoid NC-2 way 3/8″       2
    9 A5-0138 BELLOWS VALVE      1
    10 A5-0182 Valve, 12VDC       2
    11 A5-0390 Flow Switch,3/8″ NPT,1-10LPM        1
    12 2901-0040 Digital Panel Meter Assy 1
    13 5107-0010 Door Interlock Switch  1
    14 5107-0020 Cabinet Interlock 1
    15 5300-0060 Thermstat Interlock “A” 1
    16 5300-0070 Thermstat overcool “B” 1
    17 5300-0090 ThermstatOpen=150F CL=135F 1
    18 7100-0326-01-AW TC ASSEMBLY, T-SHAPE, QUARTZ        1
    19 7100-0874-11 ERP Pyro, Water Cooled 1
    20 2100-0900-078 PCA, Main Control Board 1
    21 2100-0900-054 PCA, Gas Control Board 1
    Spare Kit, Level 3
    22 A5-1001-02         Contactor, 3-P 1
    23 045-0119 RELAY, SOLID STATE, 240 VAC, 25A   6
    24 7400-0066-03 Quartz Isolation Tube with pyrometer window 1
    25 7400-0082-01-4 6-inch tray for 4 to 6 inch wafers. 1
    26 A4-0004-01 Quartz tray, Square 1
    • Items with”*” are not recommended.

    AccuThermo AW610M Specification:

    • Wafer handling:  Manual loading of wafer into the oven, single wafer processing.
    • Wafer sizes: 2″, 3″, 4″ ,5″ , 6″ wafers.
    • Ramp up rate:  Programmable, 10°C to 200°C per second.
    • Recommended steady state duration and Temperature: 0-300 seconds per step. 200°C-1050°C. Typical Maximum 1250°C.
    • Ramp down rate:  Programmable, 10°C to 250°C per second.  Ramp down rate is temperature-and-radiation-dependent and the maximum is 125°C per second.
    • ERP temperature accuracy:  ±1°C, when calibrated against an instrumented thermocouple wafer (ITC).
    • Thermocouple temperature accuracy:  ±0.5°C
    • Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer.  (Repetition specifications are based on a 100-wafer set.)
    • Temperature uniformity: ±5°C across a 6″ (150 mm) wafer at 1150°C.  (This is a one sigma deviation 100 angstrom oxide.)  For a titanium silicide process, no more than 4% increase in non-uniformity during the first anneal at 650°C to 700°C.
    • Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30 PSIG and pre-filtered to 1 micron.  Typically, Nitrogen (N2), oxygen (O2), argon (Ar), and/or helium (He) are used.

    AccuThermo AW610M Gallery:

    AccuThermo AW610M Facility:

    1. Dimension and Weight

    Equipment

    		 Diminsions

    Weight
    1 to 6 gas lines 18 H x 26 W x 14 D inch 150 LBS
    Pyrometer Chiller 28 H x 11 W x 19 D inch 50 LBS

    2. Air Conditioning:  The moisture in the ambient air around the AccuThermo RTP should not condense on any part of the system. Temperature is 20-30°C and humidity is Non-condensing.

    3. Electrical

    Power requirements vary between the United States, Europe and Japan.  It also varies if the system is constructed as a single phase or 3-phase unit.  Specifications for each are shown in the tables below. 

    Single Phase Requirements

    USA
    voltage: 208 VAC (240 VAC optional)
    # phases: single phase
    # wires: 2 supply and 1 ground
    current: 90 Amp maximum power consumption
    frequency: 60 Hz

     
    Europe
    voltage: 220 VAC (240 VAC optional)
    # phases: single phase
    # wires: 2 supply and 1 ground
    current: 90 Amp maximum power consumption
    frequency: 50 Hz

     
    Japan
    voltage: 200 VAC
    # phases: single phase
    # wires: 2 supply and 1 ground
    current: 90 Amp maximum power consumption
    frequency: 50/60 Hz

     

    3-Phase Requirements

    USA
    voltage: 208 VAC (240 VAC optional)
    # phases: 3-phase
    # wires: 3 supply and 1 ground
    current: 50 Amp maximum power consumption
    frequency: 60 Hz

     
    Europe
    voltage: 380 VAC (415 VAC optional)
    # phases: 3-phase
    # wires: 3 supply and 1 ground
    current: 50 Amp maximum power consumption
    frequency: 50 Hz

     
    Japan
    voltage: 200 VAC
    # phases:

    3-phase
    # wires:

    3 supply and 1 ground
    current: 50 Amp maximum power consumption
    frequency: 50/60 Hz

     
    • Separate power distribution box with slow trip circuit breakers are required.
    • Locate the separate power disconnect box within easy reach.
    • Total AC power line length should not exceed 25 feet
    • An isolation transformer is recommended to reduce interference to other equipment.

    Accessories Requirements

    Specification

    Equipment

    Voltage

    Frequency

    Current

    Notes

    USA

    Chiller

    110-120

    60 Hz

    11 A

    1

    Computer

    110-120

    60 Hz

    Variable

    2

    Europe

    Chiller

    220-240

    50 Hz

    5.5 A

    1

    Computer

    220-240

    50 Hz

    Variable

    2

    Japan

    Chiller

    100

    50/60 Hz

    11 A

    1

    Computer

    100

    50/60 Hz

    Variable

    2

    Note 1: 2 supply wires and 1 ground wire

    Note 2: Computer current will be dependent upon the computer manufacturer.

    4. Cooling

    The heating chamber incorporates three cooling subsystems:

    • A nitrogen or air cooling system to reduce residual heating of the quartz isolation tube and lamps.
    • A water cooling system for the chamber walls and door.
    • A closed loop pyrometer cooling system, to maintain the pyrometer at a constant temperature.

    The chamber cooling system operates during any period when power is applied to the lamps and must remain operational for 5 minutes after lamp power has been removed. The air system provides a continual flow through the system cabinet, around the lamps and the quartz isolation tube. This eliminates residual heat from the chamber. The pyrometer cooling system operates continuously, whenever power is applied to the pyrometer chiller, to stabilize and maintain the temperature of the pyrometer.

    Quartz Isolation Tube and Pneumatic 

    Cooling Air

    • type: Nitrogen (N2) or Clean-Dry-Air (CDA) oil‑and-water-free, filtered to 3 microns
    • flow rate: 10-15 scfm (283-425 slpm) minimum
    • inlet pressure:40 psig (300 kPa) typical 
    • fitting: 3/8″ Parker Push-Lok tubing ,3/8″ OD nylon tubing
    Oven
    • Cooling Water type:100% distilled water
    • Cooling Capability: >=3KW depending your maximum process temperature and steady time.
    • ISO 3696 Grade 1 (resistivity at < 10 MOhm-cm corrected to 25°C)
    • pre-filtered with conventional particulate filter to 100 microns (No DI Water)
    • flow rate: 2 gpm (7.5 lpm) minimum
    • pressure differential: 30 – 50 psi (2.1 – 3.5 kg/cm2)
    • inlet pressure: 30 psig (2.11 kg/cm2) minimum 40 psig (2.81 kg/cm2) typical 60 psig (4.22 kg/cm2) maximum
    • inlet temperature: 59°F (15°C) (3 °C above dew point) minimum 68°F (20°C) typical 95°F (35°C) maximum
    • inlet and outlet: 1/2” tube x 3/8” male pipe Swagelok
    • atmospheric humidity: non‑condensing

    5. Process Gases

    Process Gases type Any inert and/or non-corrosive gas.

     

    Typically, Nitrogen (N2), oxygen (O2), argon (Ar), and/or helium (He) are used.pressure15 psig (1.1 kg/cm2)minimum  20 psig (1.4 kg/cm2)typical  30 psig (2.1 kg/cm2)maximum flow rate0-10 SLPM  filteringpre-filtered to 1 micron fitting1/4″ female VCR fitting or 1/4” tube Swagelok

    6. Exhaust

    Oven Cabinet

    Exhaust

     flow rate100 scfm (3000slpm)fitting4″ exhaust vent connected to house exhaust system

    Gas Box

    Exhaust

    (optional)flow rate100 scfm (3000slpm)fitting4″ exhaust vent connected to house exhaust system

    FAQ on Rapid Thermal Annealing Systems:

    1. Q: Which model should I purchase?
    A: Normally your biggest substrate size determines the model. AccuThermo AW610M is up to 6 inch; AccuThermo AW820M, AccuThermo AW820V (NOT RECOMMENDED) are up to 8 inch.

    2. Q: Can I use AccuThermo AW610M,AccuThermo AW820M for 2,3,4,5 inch substrate?
    A: Yes. You can.

    Model 2 inch 3 inch 4 inch 5 inch 6 inch 8 inch
    AccuThermo AW 610M 4 pieces 3 pieces 1 piece 1 piece 1 piece N/A
    AccuThermo AW 820M 16 pieces 5 pieces 4 pieces 1 piece 1 piece 1 piece
    AccuThermo AW 820V 16 pieces 5 pieces 4 pieces 1 piece 1 piece 1 piece

    3. Q: Which type of RTP should I purchase, Atmospheric or Vacuum (NOT RECOMMENDED)?
    A: You can run most processes by Atmospheric RTP. Atmospheric RTP has much better performance ( repeatability, stability, uniformity) than traditional vacuum RTP because of atmospheric RTP’s compact chamber design, isolated quartz tube, top&bottom lamp heat, pure gas purge, 40 years approval. The ownership cost and usage cost of Atmospheric RTP are lower. If you are not sure that you have to use vacuum RTP because of O2, you can buy atmospheric RTP with forming gas to get 2 to 12 PPM O2 environment instead of vacuum RTP. Bad performance ( repeatability, stability, uniformity) and contamination issue are vacuum RTP fatal problems.

    4. Q: What are the differences in Allwin21 vacuum RTPs?
    A: AccuThermo AW820V is up to 8 inch wafer. It comes with top and bottom lamp  heating ( 27 lamps ,1.5 KW ea, TOP 13 lamps, BOTTOM 14  ,10 bank zones control). The maximum temperature is 1250C @ 10 minutes.  According to our 40 years RTP experience, we do not recommend vacuum RTP.

    5. Q: Should I have to use susceptor for transparent substrate?
    A: Normally transparent substrate can not absorb lamp heat since it is transparent. You have to use carrier which can absorb lamp heat and transfer the heat to transparent substrate. Susceptors can be made of SiC, Silica,Graphite,or Si. They can be costly. You can use a Si wafer as carrier if your process is applicable. You can us a Si wafer with pocket, instead of susceptor, if your budget is tight. A susceptor will lower the ramp rate and cooling rate significantly because of its size and thickness. 

    6. Q: Which material of susceptor should I purchase?
    A: Traditionally people use graphite with SiC coating for susceptor. Graphite susceptor is for up to 950C with lower ramp rate. Silica susceptor is for up to 1100C with higher ramp rate. Sintered SiC susceptor is for up to 1100C with lower ramp rate. Si susceptor is less expensive and up to 750C with lower ramp rate. The bigger the size of susceptor, the lower the ramp&cooling rate.Susceptors made of Graphite with SiC Coating are the most popular in the market.

    7. Q: Should I purchase an ERP Pyrometer as high temperature sensor?
    A: Thermocouples (TC’s) are the traditional temperature sensor for lower than 1050C. But TC will react with Si wafer at 750C. Our non-contact patented ERP Pyrometer can work at 400~1250C with precise measurement after calibration by AW technology. TC has to contact the substrate for temperature measurement while ERP Pyrometer is non-contact. TC cost is lower while ERP Pyrometer’s is higher (more than $15K with calibration tools (TC wafer and omega meter). TC will evaporate at high temperature causing contamination. Shield TC with SiC cap for 200-1100C is only for low budget customers.

    8. Q: Can I measure the temperature uniformity by multiple points TC wafer?
    A: If the temperature is lower than 500C, you can measure the temperature uniformity by TC wafer directly. If the temperature is higher than 500C, you have to measure other parameters’ uniformity to reflect the process uniformity. The influence of lamp, chamber, the structure of TC wafer etc is significant at higher than 500C. Semiconductor industry measures sheet resistance. LED industry measures voltage.

    9. Q: Can I have a demo before purchase?
    A: We have AccuThermo AW 610M demo systems in our facility in USA. We can do demo one time for you if you can send your wafer to us and our facilities are applicable. But be aware that you cannot evaluate the performance by a few demo results because of the following. (1) The demo condition might not be good enough; (2) Your recipe parameters might not be applicable because RTP temperature number in recipe is relative, not real.

    10. Q: What is the most important feature for RTP system?
    A: Production proven repeatability. If the RTP system performance is not repeatable, the RTP is a concept one and it will be “Rapid Trash Process”. It is crucial to buy an RTP that has been produced and verified by many customers, because we cannot buy expensive semiconductor equipment based on the product brochures, nor can we verify a semiconductor equipment based on one or two users.

    11. Q: How many gas lines can Allwin21 RTP come with?
    A: AccuThermo AW 610M, AccuThermo AW820M, AccuThermo AW820V come with 6 gas lines with 1 to 6 of MFCs. Customizing is optional. The popular MFCs are 10 SLM N2, Ar, O2 and 5 SLM NH3, N2O2.

    12. Q: Can customer install the RTP by themselves?
    A: Yes. Our RTP systems are customer-install design. We sold our RTP systems to more than 35 countries. Most customers installed our RTP systems by themselves according to our professional manuals. We provide free technical supports by email, phone, skype, APPs etc. We have local reps who can provide 24/7 service in some countries if applicable.

    13. Q: Why should we purchase an RTP from Allwin21?
    A: (1) Best production proven performance( Repeatability, Uniformity, Stability).
    (2) Our system hardware and software technology have been approved based on 40 years of semiconductor industry development.
    (3) It can cost a lot money and time to test an unpopular or new concept RTP systems .
    (4) Allwin21 focuses on RTP as our main business. We professionally provide high quality RTP system and technical support.
    (5) Reasonable price accepted by thousands of customers from 40 countries. Many options at different costs for different configurations, meeting different customers’ budget.
    (6) Industry-leading lead time (2 to 8 weeks).

    (7)  Options: Double O Ring and/or O2 Sensor/Analyzer for O2 sensitive applications and saving GaAs, InP, GaN, GaInP, SiC and other valuable compound material wafers 

    (8) PowerSum Function: Save valuable compound material wafers.

    (9) Option: Non-contact ERP Pyrometer, AG Associates Patented Parts, for best RTP performance for 400-1250C.

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