The software incorporates a Superior Temperature Control Technology that surpasses all original manufactures specs.  The AW software is capable of controlling the temperature of the wafer to ± 1°C.  It is also able to control the temperature from wafer-to-wafer to ± 0.5°C.  This is possible with the built-in automated calibration routines and the upgraded 16 bit D/A card.  First, the A/D circuits for the temperature feedback devices are calibrated.  Then the pyrometer (optional on some systems) is calibrated.  In order for the software to understand the thermal capacitance of the system, the chamber is also calibrated.  These calibration routines allow the software to understand the complete system, taking into consideration the subtleties of the A/D circuits and the thermal capacitance of heating and cooling of the process chamber.

Refer  AW Software Manual in detail.