|    Inquiry Sales Contact: Phone: 001-408-988-5188 E-mail: sales@allwin21.com
 
Products

 Rapid Thermal Process
 
·AccuThermo AW 410
·AccuThermo AW 610
·AccuThermo AW 810
·AccuThermo AW 820
·AccuThermo AW 830
·AccuThermo AW 610V
·AccuThermo AW 820V
·AccuThermo AW 860V
·Heatpulse 210/410/610
 Plasma Asher Descum
 
·Matrix 105R
·Matrix 105/205/106
·Branson IPC L3200
·Branson IPC 2000/3000/4000
·Gasonics L3510
·Gasonics Aura 1000
·Gasonics Aura 3010
·Gasonics Aura 2000LL
 Plasma Etch/RIE/ICP
 
·Lam Rainbow 4520/4528
·Matrix 303
·Lam AutoEtch 790
·Lam AutoEtch 690
·Lam AutoEtch 590
·Lam AutoEtch 490
·Gasonics AE 2001
·Lam Rainbow 4620/4628
·Lam Rainbow 4420/4428
·Tegal 903e TTW
·Tegal 901e TTW
·Tegal 903e
·Tegal 901e
·Lam Rainbow 4720/4728
·Surface Tech Sys Multiplex ICP
·STS Multiplex ASE AOE ICP CLUSTER TOOL
 Sputtering Deposition System
 
·AccuSputter AW 4450
·Perkin Elmer 4450
·Perkin Elmer 4410 Sputter
·Perkin Elmer 2400
 Metrology and Tester and Others
 
·Tencor M-Gage 300
·Hitachi CD-SEM 8840
·Hitachi CD-SEM 8820
·Hitachi FE-SEM 4700
·Hitachi FE-SEM 4500
·HP 4062UX
·HP 4145A/B
·EG 2001 Probe
·EG 1034 Probe
·AW PCM System
 

Matrix 105/205/106

Matrix 105R | Matrix 105/205/106 | Branson IPC L3200 |Branson IPC 2000/3000/4000 | Gasonics L3510 | Gasonics Aura 1000 | Gasonics Aura 3010 | Gasonics Aura 2000LL             Download Brochure

Manufacturer:Matrix

Refurbished by:Allwin21 Corp.

DESCRIPTION ( Video )                                                             New Matrix 105R VS Upgraded Matrix 105 VS Original Matrix 105

·         Self contained microprocessor controlled single wafer in line Photoresist stripper/Asher. Photoresist removal system that reduces carbon chain polymer resist in non-damaging environment. Incorporates closed control loop of vital process parameter and eliminates device damage due to thermal and electrical causes.
FEATURES ( Video )
·         Maintains independent closed loop control of process parameter (pressure, RF power, temperature, gas flow and substrate position) thus, tighter process parameter controls and resulting to more optimized process.
·         Pick and place cassette to cassette wafer transport system allows individual or batch/lot wafer selections
·         Modular configuration allows for significant reduction in maintenance/repair time which increases system availability/utilization time
·         Small footprint (only 25” X 28”) which takes up very little Fab space
·         Low temperature processing which eliminate thermal damage
·         Phase and magnitude detectors which provide “real time” RF impedance for efficient match control and better power to load transfer
·         Time or absolute end point detection system which reduces risk of over etching/under etching.
 
APPLICATION ( Video )
·         Photoresist stripping:
High Dose Implant (As+. B+, P+)
Gallium Arsenide substrates 2, 3, and 4”
Deep UV, flood exposed
Post Aluminum Dry Etching
Reworks
CD monitors
·         Controlled Resist Removal
Uniform Stripping +/- 10%
Uniform Descum +/- 5&
Dry/Wet process capability
Resist Planarization
Uniformity cap at 5% 1 sec
·         Thin Film head resist cleaning and surface treatment
·         Up to 4 hrs. of MEMS process
SPECIFICATION ( Video )
·         2 to 6” wafers capability
·         Range for Photoresist strip is 150 to 250 deg C +/- 5 deg C
·         Range for Descum is 70 to 150 deg C +/- 5 deg C
·         2 MFC configuration with 3rd MFC option for Forming gas (O2 for strip/descum)
FACILITY ( Video )
·         Electrical: 190 to 240 VAC (voltage tap selection), 50 or 60 Hz, single phase, 30A
Electrical receptacle: L6-30R
Maximum power: 6.3Kw
Normal power usage: 2.1 Kw
Isolated grounding, #10 AWG with THHN insulation
Grounding resistance <10 Ohm at 50 or 60 Hz.
·         Process vacuum pump requirement: 30 cfm (845 L/min), KF40 inlet
Electrical: 208 VAC, 1 phase, 20A
·         Robot vacuum pump requirement: constant 25 in Hg, ¼” Swagelok fitting (stand alone or house vacuum)
·         Environmental requirement: A/C during operation min 60 deg F (16 deg C) and max 80 deg F (27 deg C)
·                                                                    A/C at idle min 60 deg F (16 deg C) and max 80 deg F (27 deg C)
Humidity: non-condensing, at 68 deg F (20 deg C), min @ 20% and max @ 60%
·         Closed loop temperature controller:
Temperature range: 20 to 100 deg C
40% Ethylene Glycol and 60% Distilled Water
Flow requirement: 8 LPM
Cooling capacity: at 20 deg C, 5000 BTU (1466w)
Pressure adjustment: 0 to 80 psig
Heater capacity: 2 Kw
Chamber capacity: 1.5 gal (6 L)
Tube inlet and outlet fittings: 3/8” compression Swagelok
Pipe material: polypropylene tubing
·         Heat Dissipation:
Main Console: 4500 BTU
Closed loop temp. Controller: 6000 BTU
·         RF Generator
Freq.: 13.56 Mhz
208 VAC, 1 phase, 20A, 600 watts
Coolant flow requirement: 2GPM (7.6 LPM) @ <60 psi
Water temperature: max 27 deg C
Water inlet and outlet fittings: 3/8” compressed Swagelok
·         House Exhaust for Process module cabinet and Pumps
Greater than 100 cfm flow
4” (10cm) OD
Exhaust must be dampened <200 cfm
Separate exhaust drops for Main console and pumps
Isolated exhaust for process module and vacuum pump
·         Gases:
O2: 99.83% purity
         8 to 10 psig
         Gas regulator set at <30 psig and <10’ from process chamber module
         Consumption: 5 LPM
        ¼” VCR,  316 SS process piping required with .2um point of use filter
N2: .2% Gaseous impurity, 60 to 80 psi, ¼” compressed tube fitting (Swagelok)
         Process pipe material: 316 SS
         Consumption: 17.5 LPM (35.5 CFH)
         Point of Use filter: .2 um
WEIGHT/DIMENSION/FOOTPRINT/SPACE REQUIREMENT ( Video )
·         Main Console Weight: 100 lbs. (45 kg.)
·         Power Supply Console Weight: 310 lbs. (141 kg.)
·         Dimensions: Main console: 25” Width (64 cm) X 58” Height (147 cm) X 28” Depth (70 cm)
·         Dimensions: Power supply console: 25” Width (64cm) X 28” Depth (71cm) X35” Height (89cm)

·         Footprint: 25” Width (64mm) X 28” Depth (70cm). Requires rear clearance of 14” (35cm) for plumbing and 18” (46cm) for servicing. In addition side clearance of 6” (15cm) and top clearance of 12” (30.5cm) are also necessary.

 

 

 

 

 

New  Matrix 105RVS Upgraded Matrix 105 VS Original Matrix 105

 

Comparing Item New Upgraded Original Matrix 105
Matrix 105R Matrix 105

Wafer Transfer

Equipe Solid Robot

Frog Robot

Frog Robot

Robot Control

Robot controller with PC, more stable

New robot control board, easy to trouble shooting

Old robot control board

Cassette Station

Solid cassette station, no trouble shooting

Elevator station

Elevator station

Wafer Aligner

Yes, much better performance

None

None

RF interfere

No

Some time

Some time

Frame

New

Used

Used

Controller

New PC

New PC

Z-80 MPU

Monitor

Touch Screen

17" LCD

OLD 

User Interface

GUI

GUI

Text

Data Storage

Store in Hard Disk

Store in Hard Disk

None

Recipe Edit

Easy to edit with GUI

Easy to edit with GUI

Magnetic Card

On Line Help

Yes

Yes

None

Gas Calibration 

Easy to do with GUI

Easy to do with GUI

None

Diagnostic Function

More functions and I/O hardware "exposed" for easier maintenance and trouble shooting

More functions and I/O hardware "exposed" for easier maintenance and trouble shooting

Limited

A/D Precision

14-16bits

14-16bits

12bits

PCB 

Only one, new, not next to chamber, more stable

Only one, new, stable

5 original used PCBs, pain

Valves

New

Used

Used

Meters

New

Used

Used

MFC

New

Calibrated

Calibrated

Gas lines

New

Polished 

Used

Chamber

New

Re-anodized

Used

Chuck

New

Re-anodized

Used

Heat Element

New

Used

Used

Door

New

Re-anodized

Used

O Ring

New

New

Used

Quartz chamber

New

Used

Used

Quartz Buffer

New

Used

Used

RF Power

New

Used

Used

RF Match

New

Used

Used

RF Electrode

New

Used

Used

Pump Ring

New

Re-anodized

Used

Bottom plate

New

Used, cleaned

Used

AC/DC/Pressure/Temperature Modules

AC/DC/Temperature in one new module, PCB pressure control, compact, easy trouble shooting, more stable

AC/DC/ New Pressure/Temperature Modules, more stable

Used modules, not stable

Temperature measure precision

±1.5 °C

±1.5 °C

±5.0 °C

Temperature control repeatability

±1.5 °C, New Eurotherm

±1.5 °C, New Eurotherm

±5.0 °C, used old Omega

Cables

New, stable

Used

Used

Wires

New, stable

Used

Used

Other Components

New

Used

Used

Uniformity

0.05

0.05

0.1

Stability

Much Better

Better

Limited

Overall Space

Main Console

Main Console plus PC

Main Console

 

 

Equipment By Categoty : Rapid Thermal Process | Plasma Asher Descum | Plasma Etch/RIE/ICP | Sputtering Deposition System | Metrology and Tester

Equipment By Manufacturers : Allwin21 Corp. | Perkin Elmer | Matrix | Tegal | Lam Research | Gasonics | Branson | STS | ELECTROGLAS | Hitachi | KLA-Tencor | HP

Sales Contact: Phone: 001-408-988-5188 Fax: 001-408-904-7168 Address: 3521 Leonard Court Santa Clara,CA 95054 E-mail: sales@allwin21.com Copyright © 2006-2016 Allwin21,Corp. All Rights Reserved