Condition:Used (Refurbished and warranty is available). Contact Us for more information.
Wafer Size Capacity:3,4,5,6 inch
Cassette To Cassette In-line Single Wafer Plasma Etcher.Capability to etch vias and contacts with anisotropic or sloped profiles.For etching silicon dioxide, silicon nitrides, and polyimides.Can handle wafers from up to 6 in. Microprocessor control.208 V, 50/60 Hz. Tegal 901e series Plasma/RIE etch System are used by the Semiconductor Industry for integrated circuit fabrication. The system are used in one part of the sequence of manufacturing steps that transfer a pattern formed from a layer of photosensitive material, the photoresist, to a layer that makes up a permanent part of the final device. The process of defining a pattern with photoresist known as photolithography, while the etch process transfers the photoresist pattern to the permanent layer.Tegal 900 Series systems deliver highly reliable, repeatable results in etching a variety of films used to manufacture semiconductor, telecommunications and optoelectronics devices, flat panel displays and thin film magnetic heads.Tegal 901e,are designed around a production-proven wafer transport design that can accommodate 75 mm to 150 mm round silicon, GaAs, InP, and dielectric material substrates. The transport can also be configured to accommodate rectangular substrates up to 125 mm on a side.
Typical Applications for Tegal 901e:1. Nitride etch, 2. Photoresist Descum, 3. Polyimide and BCB etches, 4. Zero Layer Etch, 5. Backside Etch, 6. Isotropic Oxide Etch,7. Non-critical Polysilicon Etch8. Titanium/Tantalum Alloy Etch.