|    Inquiry Sales Contact: Phone: 001-408-988-5188 E-mail: sales@allwin21.com
 
Products

 Rapid Thermal Process
 
·AccuThermo AW 410
·AccuThermo AW 610
·AccuThermo AW 810
·AccuThermo AW 820
·AccuThermo AW 830
·AccuThermo AW 610V
·AccuThermo AW 820V
·AccuThermo AW 860V
·Heatpulse 210/410/610
 Plasma Asher Descum
 
·Matrix 105R
·Matrix 105/205/106
·Branson IPC L3200
·Branson IPC 2000/3000/4000
·Gasonics L3510
·Gasonics Aura 1000
·Gasonics Aura 3010
·Gasonics Aura 2000LL
 Plasma Etch/RIE/ICP
 
·Lam Rainbow 4520/4528
·Matrix 303
·Lam AutoEtch 790
·Lam AutoEtch 690
·Lam AutoEtch 590
·Lam AutoEtch 490
·Gasonics AE 2001
·Lam Rainbow 4620/4628
·Lam Rainbow 4420/4428
·Tegal 903e TTW
·Tegal 901e TTW
·Tegal 903e
·Tegal 901e
·Lam Rainbow 4720/4728
·Surface Tech Sys Multiplex ICP
·STS Multiplex ASE AOE ICP CLUSTER TOOL
 Sputtering Deposition System
 
·AccuSputter AW 4450
·Perkin Elmer 4450
·Perkin Elmer 4410 Sputter
·Perkin Elmer 2400
 Metrology and Tester and Others
 
·Tencor M-Gage 300
·Hitachi CD-SEM 8840
·Hitachi CD-SEM 8820
·Hitachi FE-SEM 4700
·Hitachi FE-SEM 4500
·HP 4062UX
·HP 4145A/B
·EG 2001 Probe
·EG 1034 Probe
·AW PCM System
 

Tegal 903e

Tegal 901e | Tegal 903e |Tegal 901e TTW | Tegal 903e TTW | Lam Rainbow 4420/4428 | Lam Rainbow 4520/4528 | Lam Rainbow 4620/4628 | Lam Rainbow 4720/4728 | Lam AutoEtch 490 | Lam AutoEtch 590 | Lam AutoEtch 690 | Lam AutoEtch 790 | Matrix 303 | Gasonics AE 2001 | STS Multiplex ICP                      Download Brochure

Manufacturer:Tegal
Refurbished by:Allwin21 Corp.
DESCRIPTION: FEATURES:
Production proven, highly reliable and cost effective workhorse for low temperature cassette to cassette in line single wafer plasma etch system used in etching a variety of films on Silicon, GaAs, InP and other dielectric material substrates. Fully refurbished to OEM spec.
 
Customization capability to meet customer requirements
 
Can accommodate 75mm to 150mm wafers
 
Non-friction type spatula pick and place wafer transport
 
Superior, versatile and repeatable process results
 
Low cost ownership and high throughput
 
12 month warranty
 
Able to support end of the life components in the system
APPLICATIONS: SPECIFICATIONS:
MEMS
 
Silicon ICs (photoresist Descum, Nitride etch, Polymide and BCB etch, Reaction Ion etch, Zero Layer etch, Backside etch, Isotropic Oxide etch, Non-critical Polysilicon etch, Titanium/Tantalum Alloy etch)
 
Optronics (telecommunications)
 
Thin Film Magnetic Heads
 
Nano Tech
 
Biomedical
 
Solar Cells
 
Flat Panel Display
Control system: Microprocessor controlled (PC) or customized
 
Process pressure range: 100mT to 4Torr
 
Process Temperature range: 25 to 35 deg. Centigrade
 
RF power range: up to 1KW (13.56 Mhz.)
 
Gas 1: N2 MFC
 
Gas 2: CHF3 MFC
 
Gas 3: SF6 MFC
 
Gas 4: He MFC
 
Clean metering needle valve (O2)
 
UPC (process dependent on customer requirement)
 
Typical operating temperature for lower electrode: 1 to 5 deg. C above ambient temp. to prevent moisture condensation (typical 25 deg. C).
 
Typical operating temperature of upper electrode= 1 to 5 deg. C above lower electrode temperature.
FACILITY: WEIGHT/DIMENSIONS:
Electrical: 200-240 VAC selectable frequency (50/60 hz.), 30A, 3 wire, single phase and 2 pole. Requires high in rush circuit breaker (not supplied).
 
CDA: CDA/N2 for pneumatics 85 +/- 5 psig, filtered and dry., ¼” standard brass compression type fitting (Swagelok)
 
Reactor Vent/Purge and Ballast: 10 – 30 psig filtered and dry
 
Cooling Water: Single channel circulating chiller, distilled water only, cap. 2.8 gal., outlet pressure:@ 40 psig , 45 psig max., temp range: 0 to 80 deg. C, Flow rate: at 40 psig= o.4 +/- .05GPM (1.5 +/- .2 LPM), connecting hose must withstand coolant at 40 psig at 80 deg. C. Use ¼” tubing.
 
Gasses: Gas 1: 10 +/-5 psig
 
Gas 2: Max 10 psig
 
Gas 3: Max 10 psig
 
Gas 4: 10 +/- 5psig
 
Clean needle valve (O2)= 10 +/- 5 psig
 
Exhaust: Cabinet exhaust: 100 CFM (2.832 LPM) min. OD= 4.0”
 
Vacuum pump exhaust: 26.8 CFM (760 LPM), 1.5” OD, NW 40 fitting
 
Process vacuum:   Pump rating= 28.3 CFM (802 LPM), Pump Speed= 21 CFM (594.3 LPM) min, Vacuum connection= 1.5” (3.81cm) OD, NW40, Vacuum hose= 1.5” terminated with NW40 fitting.
 
 
Height: 26” (66.04cm) cabinet (closed)
 
                 44” (111.8cm) cabinet (opened)
 
Width:   44” (111.8cm)
 
Depth:   42” (106.7cm). Allow 15” (38.1cm) for servicing and plumbing.
 
Footprint: 20.5” (52.07cm) W X 30” (76.2cm) D
 
Weight: 500 lbs. (227.27 kg.)
 
** weight of water chiller and RF generator units excluded from computation.

 

 

Equipment By Categoty : Rapid Thermal Process | Plasma Asher Descum | Plasma Etch/RIE/ICP | Sputtering Deposition System | Metrology and Tester

Equipment By Manufacturers : Allwin21 Corp. | Perkin Elmer | Matrix | Tegal | Lam Research | Gasonics | Branson | STS | ELECTROGLAS | Hitachi | KLA-Tencor | HP

Sales Contact: Phone: 001-408-988-5188 Fax: 001-408-904-7168 Address: 3521 Leonard Court Santa Clara,CA 95054 E-mail: sales@allwin21.com Copyright © 2006-2016 Allwin21,Corp. All Rights Reserved