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System Description:

The Lam AutoEtch 790 is a fully automated, single-wafer plasma barrier metal/alloys (such as Titanium / Tungsten) etching system that processes 4-, 5-, 6- inch wafers and features top
powered electrode plate, programmable electrode spacing, and automatic wafer alignment and placement. Designed for continuous operation, the Lam AutoEtch 790 etcher is computer-controlled, allowing either manual or automatic control.

Wafer Transport

The wafer transport system is responsible for moving wafers through the system. It picks up a wafer from a cassette on the send indexer, centers and aligns it, transports it to the chamber for processing, and finally, when processing is complete, deposits it into a cassette on the receive indexer. Major assemblies in the wafer transport system include send and receive indexers, a load station that centers and aligns the wafer,
and entrance and exit loadlocks with mechanical arms.

Operator Controls

The operator controls consist of control panels with switches andindicator lights, and a computer-controlled operator interface that runs software.The etcher uses software to control machine functions, record and run process recipes, and warn of conditions that require the attention of an operator or maintenance technician. The software has a graphical user interface (GUI) that employs a combination of icons, buttons, and selectable commands, together with detailed graphics.

The system includes the following.

1. Send Indexer
2. Receive Indexer
3. Entrance Lifter
4. Exit Lifter
5. 4 Pin Lifter
6. Gap Assembly
7. Lower Match Assembly
8. Upper Electrode Assembly
9. Lower Electrode Assembly
10. 5 MFC Gas Box
11. Main Power Supply
12. Main Chamber Generator
13. 2 Recipe Modules, 2 Master Modules
14. Front & Rear EMO Switches
15. Panels & Plexi Glass Covers (Standalone System)
16. Main Chamber, Hex Plate, Orifice Ring, Pump Ring
17. 2 Channel Endpoint Detector