Condition:Used (Refurbished and warranty is available). Contact Us for more information.
Wafer Size Capacity:3 to 6 inch
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Single Wafer, Multi-Step Processing
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Closed-Loop Temperature Control
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Pressure Control
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Accurate, closed-loop pressure control with ¡°butterfly-style¡± throttle valve and capacitance manometer
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RF power: 100 to 500 watts
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Timed cycles up to 4 hour each
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No RF damage (¡ê0.1 volt CV shift)
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High throughput
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Front and backside etching
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Excellent etch rates and uniformities
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100mm ¨C 150mm wafer capability
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Variable platen temperature
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Alumina (ceramic) plasma tube
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Fluorine compatible chamber
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Well-characterized process
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Multiple step process capability
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High capital productivity.