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Condition: Refurbished and Upgraded by Allwin21 Corp With Alliwn21 Own Software
Single wafer processing
Two process gas MFC's
4", 5", 6" and 8" wafer capability
Programmable process recipe control by Allwin21 Own New Software.
Automatic wafer loader/unloader with solid robot instead of the original Z-bot.
Infrared heat source with Allwin21 RTP control technology for process temperature control.
Downstream processing with Wave Guide
Soft-start vacuum system.
Equipped with hard-wired safety interlocks to prevent damage to the system or injury
Front and backside photoresist removal
Automatic photo emission type end-point detection
The GaSonics AURA 3010 (3000) Stripper System with the Allwin21 Upgrade Kit (Allwin21 System) has been designed to be customer-installed and maintained. GaSonics AURA 3010 (3000) is a PC controlled photoresist stripping system. It strips the front and back surfaces of a single wafer for short periods of time.The GaSonics AURA 3010 (3000) is a fully automated, cassette-to-cassette, single-wafer processing system.The GaSonics AURA 3010 (3000) generates plasma of oxygen and/or other gasses in a reaction chamber. This concentrated reactive mixture then flows downstream, reaching a state of electrical neutrality. Although highly reactive, it is no longer electrically damaging to the wafer. The mixture then enters the process chamber, where the dissociated oxygen reacts with the photoresist and oxidizes the photoresist from the wafer.
High dose implant (As+, B+, P+)
Post-develop descum (pre-etch)
Dry/wet process capability
Principles of Operation
Wafer movement is accomplished by a Equipe Solid Robot having three axes of motion. The robot arm end-effector is supplied with vacuum to hold the wafer in place as it is moved. When the wafer is placed in the process chamber, it rests on three sapphire rods which support the wafer at its edge.
The chamber is heated by twelve heater cartridges embedded in the chamber wall. When the wafer is placed in the chamber for processing, it is heated to process temperature by eight halogen lamps under the chamber.
Oxygen and a small quantity of Nitrogen are mixed and delivered to a quartz plasma tube in the waveguide assembly. Microwave energy, generated
by the magnetron, excites the gas mixture to form a plasma, in which the molecular Oxygen and Nitrogen gases are dissociated into atomic Oxygen and Nitrogen. The active species are carried downstream out of the source region through a gas distribution plenum. The high-energy reactive species, which can cause damage to the wafer, are destroyed by 3-body gas-phase recombination in the source and by surface recombination in the plenum. The lower-energy free radicals and neutrals, which are responsible for the photoresist oxidation, are carried to the wafer surface where the photoresist removal takes place.
The end of the removal process can be determined by detecting, and measuring the rate of change in the light emitted by the gas plasma itself as the photoresist removal progresses. At the end of the removal process, the halogen lamps are turned off, microwave power is turned off (and consequently,
the plasma is extinguished), and the process gas flow is turned off. The chamber is then purged with nitrogen before being vented to atmosphere for wafer removal.
The wafer is then transferred from the chamber to the cooling station. The cooling station is a water cooled platen.
The cool wafer is then transferred back to its original slot in the cassette.
Pressure : 0.5 to 5.0 Torr
Microwave : 1400 watts
Gas Flow O2 : 3.0 SLPM
Gas Flow N2 : 0.3 SLPM
Lamp Time (variable) Software Control
Temperature (variable) 90-360oC (typical)
Closed loop temp control Allwin21 SW
Ash Rates : 1.0-3.5μ/min. positive photoresist
>8μ/min. negative photoresist
Uniformity: < 10%
Selectivity to Underlying Films : >1000:1
Throughput : Up to 60 wph (typical)
Particle Control : <0.05 p/cm2 0.3μ
Damage Control: <0.IV CV shift for 250Å gate oxide
Availability: >95% uptime
MTBF : >100 hours
Utilities and Weight and Dimension .
Vacuum (pumps) 165 cfm
Cabinet Exhaust >250 cfm
Process Gases : 2 MFC’s
Electrical Requirements :208V, 3 phase, 60 Hz 30A
Weight : 1000 lbs
Dimension: 30” W x 38" D x 58” H
Allwin21 Software Features
The system is controlled by menu commands from the control software. This software allows a great deal of flexibility and control of the Allwin21 machine.
The AW-ASH control software features the following:
Automated calibration of all subsystems from within the control software. This allows faster, easier calibration, leading to enhanced process results.
Closed-loop temperature control with thermocouple temperature sensing.
Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the Allwin21 system chamber.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration and setup functions.
Simple and easy to use menu screens which allow a process cycle to be easily defined and executed.
Troubleshooting features which allow engineers and service personnel to activate individual subassemblies and functions.
The control software runs on any Pentium class PC computer with a parallel (printer) port. The computer interfaces to the Allwin21 system with only 1 cable, the control interface cable.
- The interface board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
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We believe that the suitable is the best.