|    Inquiry
 
Products

4  Rapid Thermal Process
 
·LEDs Production RTA RTP-AW810
·Refurbished AG Heatpulse 210
·Refurbished AG Heatpulse 410
·Refurbished AG Heatpulse 610
·Refurbished AG Heatpulse 21XX
·New AccuThermo AW 810M
·New AccuThermo AW 610
·New AccuThermo AW 410
4  Plasma Asher Stripper Descum
 
·Refurbished Matrix 205
·Refurbished Gasonics Aura 3010
·Refurbished Branson IPC 3000
·Refurbished Matrix 10
·Refurbished Gasonics L3510
·Refurbished GaSonics Aura 2000LL Loadlock Asher
·Branson IPC L3200-Long time Plasma Asher Process
·Refurbished Gasonics Aura 1000
·Refurbished Matrix 105
4  Plasma Etch
 
·Lam Autoetcher 590
·Lam AutoEtch Lam 490
·Refurbished Tegal 901e
·Refurbished Matrix 303
·Refurbished Matrix 403
·Refurbished Gasonics AE 2001
·Lam Rainbow 4520 Oxide Etch
·Lam Rainbow 4428 for Plasma Etch
·Lam Rainbow 4420 Plasma Etch
4  Reactive ion etching (RIE)
 
·Plasma Therm VII 70 Series
·Refurbished STS 320 RIE
4  PECVD
 
·Refurbished STS 310 PECVD
4  Inductively coupled plasma (ICP)
 
·Refurbished STS 320 ICP
4  Metrology & Inspection
 
·Hitachi S8840 Scanning Electron Microscope
·XFlash® QUAD 5040 Detector
·XFlash® 5030 Detector
·XFlash® 5010 Detector
·Energy Dispersive X- Ray Spectrometer QUANTAX 200
·LEO FE-SEM model 982
·Micrion FIB model M9500
·Hitachi FE-SEM model S-4160
·Hitachi FE-SEM model S-4700
·Hitachi S-4500 SEM Cold Field Emission SEM System
·Hitachi S-8820 CD SEM
·Hitachi S-9300 CD SEM_SDI
·Hitachi S-4800 SEM Cold Field Emission SEM System
4  Misc.
4  Backside Equipment
4  Lab Equipment
 
·Muffle Furnaces (400-1800C)
·Tube Furnaces (1-5 Zone)
·Hi-Pressure Furnace
·RTP Furnaces
·Dental Sintering Furnaces
·Induction heaters&CZ grower
·Lab Ovens / Hot Plates
·Melting Furnaces
·Cutting / Dicing Saws
·Polishing Machines
·Desktop Machine-shop
·Glove Box
·Film Coaters
·Lab Press & Rollers
·Laboratory Mill / Mixer
·Battery / Capacitor Analyzers
·Desk-Top X-Ray Instruments
·Digital Microscopes
·DI Water / Ultrasonics
·UV Equipment & Adhesives
·Lab Ware / Accessory
·Round Wafer Carriers
·Sticky & Film Boxes
·IC Tray & Plastic Boxes
·Vacuum Pen&Tweezers
4  Electrical Test and PCM Software
 
·Electronic Tester List
·Temptronic TP03500
·HP 4142B
·Refurbished HP 4145B
·Refurbished HP 4062UX
·Refurbished HP 4155
4  Sputtering and Evaporator System
 
·Upgrade MRC903A Sputter System
4  Lithography & Photoresist
 
·IOS.Cube 6 | Series
·IOS.Cube 5 | Series
·IOS.Cube 3 | Series
·IOS.Cube 2 | Series
·IOS.Cube 1 | Series
4  Wet Processing
 
·SV-702 Spin Rinse & Dryer (SRD) system
·SV-802 Spin Rinse & Dryer (SRD) system
·ASD-SH-802 Horizontal Spin Dry-In
4  Wafer Probers
 
·Refurbished EG 4085X
·Refurbished EG 1034
·Refurbished EG 2001
·Refurbished MP 2020
·Refurbished EG 2010
4  Chiller
4  Pump
4  RF Power
4  Oven
4  Gas Cabint
4  Inventory on Sale
4  Gallium Nitride Material
 
·free-standing GaN substrate
·GaN Templates
4  Bulk Equipment on sale
 

Inventory >> PECVD >> STS 310 PECVD

STS 310 PECVD

Click to Enlarge

Manufacturer:STS Plasmafab

Refurbished by:Allwin21 Corp

STS 310 PECVD (Plasmafab PF310) Deposition System comprises of a Power Supply Console, the Deposition main frame and the Monitor trolley complete with keyboard.

STS310 PECVD is controlled by an Intel 8085A microprocessor to create plasma reaction conditions within the Vacuum Chamber for the deposition process.

Each Deposition Program, of which there are three, has a sequence of processes which can be controlled through the microprocessor in any order. There are ten process pages which are programmed into the microprocessor, but these are reduced to seven should an annealing process be required.

A Mimic Display Page shows STS 310 PECVD operating during the “start-up and process time” and instruct the operator when to open the chamber lid, by operating the two pushbuttons, on the front panel to either place the substrate in the chamber at the start of the process or to remove the substrate at the end of the process. “Fault flags” are displayed should any malfunction occur during the process. This may be a process gas valve not functioning, loss of process gas, loss of compressed air, R.F. supply not on etc.

Automatic start up and shutdown procedures are programmed into STS 310 enabling the operator to control the state of the system at all times.

A Roots/Rotary Pump combination is used to evacuate the process chamber. Dry Nitrogen ballasting is encorporated into the pumping system to prevent the majority of any corrosive gases condensing during the compression cycle of the pump and also to dilute any particulate in the oil box.

The process gases are monitored by mass flow controllers which are isolated by pneumatically operated stainless steel bellows valves. Silane process gas and Oxygen clean gas are isolated from each other to obviate any possibility of mixing. The Nitrogen vent gas is metered by a Rotameter gauge.

The Power Supply Console is free standing, and may be sited adjacent to the Deposition main frame, or in area the area behind the clean room should this type of environment be selected. Interconnect cables and hoses are provided for the connection between the two main units. The air cooled console houses the R.F. Power to the electrodes, the heater power supply, the microprocessor and all the sub-units necessary for processing. The monitor and operator control panel/keyboard of STS 310 PECVD can be positioned on a convenient work station or desk. Interconnect cables are supplied between the main frame and monitor, and the control panel.

STS 310 PECVD system data:


Primary Power Supply

208/220V 3 phase and neutral                                 30A per phase
380/440, 3 phase and neutral
15A per phase

Water Supply

(R.F. Power Supply
And Heat Sinks)

Demineralised or distalled water is recommended. If unavailable, tap water can be used if it has a minimum specific resistance of 10K ohms-centimeter. The solid content must be less than 30 ppm and a pH value of 6.0-7.5.
Maximum inlet temperature 25℃.
Filtering may be necessary.

Compressed Air

90 psig (6 bar) maximum
75 psig (5 bar) minimum
Dry, filtered and oil free

Nitrogen, Dry and filtered

 

400 litres/hour @ l bar
7 cu.ft./hour @ 15 psig

Process Gases

To suit process requirements 5 psi to
10 psi from external sources.
Supplies must be connected with stainless steel pipework.

TECHNICAL DATA

 

R.F. Power Supply

 

187.5 KHz, 500 watts or 1000 watts output

Heater Power Supply

Up to 360℃.(2KW HEATER) with P.I.D. Control

Control System

Intel 8085 microprocessor based system with VDU display and keyboard control.

Mass Flow Controller

One per process gas.

No of Programmable Processes

Ten Deposition Processes or Seven Deposition Processes and three Anneal Processes.

No of Slats

seven

Process Time

Up to 59 minutes 59 seconds for each process.

 ______________________________________________________________

Allwin21 Corp. can also provide  Allwin21 Corp proprietary AW Control Software and Superior Temperature Control Technology  to upgrade the refurbished equipment which provides the following significant advantages:

    • Pressure Control
    • New hardware includes: New control Board with cable, new timer counter with watch dog, Pentium Computer with 17” LCD Monitor, standard keyboard and mouse.
    • Software calibration and easy to be done.
    • More functions and I/O hardware “exposed” for easier maintenance and trouble shooting.
    • It is easy to edit recipe with GUI and graph display.
    • Save all process data on the computer hard disk.
    • A/D and D/A precision is 14 to 16 bits.
    • Detect in process and with color curve displayed on the screen.
    • Software watch dog to eliminate machine damage duo to the computer locks up or freeze.
    • Sensor status detect function.
    • On line help function
    • Better performance and maintenance than the original STS 310 PECVD systems
    • Excellent etch rates and uniformities

 


Home | Company | Products | Service | Spare Parts | Contact Us | News
Allwin21 Corp. Phone:001-408-988-5188 Fax:001-408-9047168 3251 Leonard Court Santa Clara,CA 95054 e-mail:sales@allwin21.com
Copyright © 2000-2006 Allwin21,Corp. All Rights Reserved