Manufacturer:Matrix Integrated Systems
Refurbished by:Allwin21 Corp
Matrix is a Registered Trademark of Matrix Integrated Systems, Inc.Matrix 105 provides high throughput in a single wafer system capable of handling wide variety of substrates, including round, square and ranging from 3” up to 6”. By maintaining independent closed-loop system controls, the system optimizes vital device parameters.
- Single Wafer, Multi-Step Processing
- Closed-Loop Temperature Control
- Pressure Control
- Accurate, closed-loop pressure control with “butterfly-style” throttle valve and capacitance manometer
- RF power: 100 to 500 watts
- Timed cycles up to 4 hour each
Matrix105 Applications
Photoresist Stripping
- High dose implant (As+, B+, P+)
- Post-polysilicon etch
- Post-metal etch
- Post-oxide etch
- Rework
Controlled Resist Removal
- Post-develop descum (pre-etch)
- Dry/wet process capability
- Resist planarization
- Uniformity capability (5% 1s)
GaAs wafer Stripping and Descum
Thin Film Head Resist Cleaning and Surface Treatment
MEMS (Micro Electro- Mechanical Systems) Up to 4 hour processes
Matrix 105 consists of the following major assemblies:
Process Model,
Operator interface Model,
Wafer Transport Module,
Elevator Module,
PC Control Module.
RF Generator,
DC Supply,
AC Distribution,
Gas Distribution panel,
Temperature/Pressure Control Module.
Vacuum Hose and Connector, Ballast Assembly.
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Allwin21 Corp. can also provide advanced Equip Robot transfer wafer technology , AW Control Software and Superior Temperature Control Technology to upgrade the refurbished Matrix 105 which provides the following significant advantages.
- New hardware includes: New control Board with cable, new timer counter with watch dog, Pentium Computer with 17” LCD Monitor, standard keyboard and mouse.
- Software calibration and easy to be done.
- More functions and I/O hardware “exposed” for easier maintenance and trouble shooting.
- It is easy to edit recipe with GUI and graph display.
- Save all process data on the computer hard disk.
- A/D and D/A precision is 14 to 16 bits.
- Detect in process and with color curve displayed on the screen.
- Robot teach is on the GUI and easy to do the procedure with new concept teaching method.
- Software watch dog to eliminate machine damage duo to the computer locks up or freeze.
- Sensor status detect function.
- On line help function
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In semiconductor manufacturing plasma asher/stripper is the process of removing the photoresist from an etched wafer. Using a plasma source, a monatomic reactive species is generated. Oxygen or fluorine are the most common reactive species. The reactive species combines with the photoresist to form ashing which is removed with a vacuum pump.
Typically, monatomic (single atom) oxygen plasma is created by exposing oxygen gas (O2) to ionizing radiation. At the same time, many free radicals are formed which could damage the wafer. Newer, smaller circuitry is increasingly susceptible to these particles. Originally, plasma was generated in the process chamber, but as the need to get rid of free radicals has increased, many machines now use a downstream plasma configuration, where plasma is formed remotely and channeled to the wafer. This allows electrically charged particles time to recombine before they reach the wafer surface, and prevents damage to the wafer surface.
Monatomic oxygen is electrically neutral and although it does recombine during the channeling, it does so at a slower rate than the positively or negatively charged free radicals, which attract one another. Effectively, this means that when all of the free radicals have recombined, there is still a portion of the active species available for process. Because a large portion of the active specie is lost to recombination, process times may take longer. To some extent, these longer process times can be mitigated by increasing the temperature of the reaction area.
Allwin21 Corp can provide the following refurbished plasma asher/descum equipment.
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