AccuThermo AW 810M is a desktop rapid thermal processor for 5 to 8 inch wafer , which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity advanced temperature control technology and AW 900 new software, provide significant advantages over conventional furnace processing and conventional RTP systems. 

AccuThermo AW 610 is a desktop rapid thermal processor for 2 to 6 inch wafer, which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity advanced temperature control technology and AW 900 new software, provide significant advantages over conventional furnace processing and conventional RTP systems. 

AccuThermo AW 410 is a desktop rapid thermal processor for 2 to 4 inch wafer ,which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity advanced temperature control technology and AW 900 new software, provide significant advantages over conventional furnace processing and conventional RTP systems

AG Heatpulse 610 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity,  provide significant advantages over conventional furnace processing and conventional RTP systems.

AG Heatpulse 410 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity,  provide significant advantages over conventional furnace processing and conventional RTP systems.

The tool for Rapid Thermal Process is Peak ALP 5000 (Peak 8500).The Peak Rapid Thermal Processor or RTP System heats substrates with its SP35X lamp,which sits at top the chamber.Gases can be introduced  into the process chamber ,and with the vacuum option,the pressure within the process chamber can be lowered and raised.Wafers are moved into and out of the process chamber by the system.

AG Heatpulse 210 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity,  provide significant advantages over conventional furnace processing and conventional RTP systems.

The results of experiments performed to evaluate the use of a commercially available rapid thermal annealer (RTA) with a graphite susceptor for capless rapid thermal annealing to activate implants in GaAs are reported in many articles. The interior of the susceptor was easily charged with As by annealing a sacrificial GaAs wafer.

1 OVEN-Control
2 ZERO-crossing
3 Timer-Counter
4 RMS Analog Card
5 STD Interface Card
6 MIO-24-I/O
7 A/D-D/A

Matrix is a Registered Trademark of Matrix Integrated Systems, Inc.Matrix 105 provides high throughput in a single wafer system capable of  handling wide variety of substrates, including round, square and ranging from 3” up to 6”. By maintaining independent closed-loop system controls, the system optimizes vital device parameters. 

Gasonics  is a Registered Trademark of Novellus Corp.GaSonic Aura 1000 Plasma System is the microprocessor controlled down-stream, or  “ afterglow” photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute. The unit is fully automated, cassette-to-cassette, and is a single-wafer process design.  

The Branson IPC 3000 is a barrel plasma etcher that uses oxygen to etch organic films and residues such as photoresist in a process commonly referred to as "de-scumming." During a normal run for the Branson Barrel Etcher, the chamber is evacuated to under 0.5 torr pressure.

Gasonics  is a Registered Trademark of Novellus Corp. Gasonics Aura 2000LL is a 8" Cassette to Cassette ,Single Wafer Downstream Microwave Asher w/ Loadlock with microwave source and a dictated reactor chamber ,8" Cassette to Cassette ,Single Wafer Asher ,Configured for 4" - 8" wafers,Loadlock with cool-down station for processed wafer Gas box,

Branson/IPC  L3200 single wafer downstream stripper,Dual quartz chambers for 100-150mm wafers( or 150-200mm wafers), cassette to casette operation

Aura 3010.The Aura 3010(Aura3000) is a single-wafer downstream photoresist asher, delivers high ash rates with low damage, a large process window, and a choice of process temperatures during the ashing process. The system has a user friendly menu-driven user interface, and is suitable for automation via SMIF (Standard Mechanical Interface) or AGV (Automated Guided Vehicle).3”, 4”, 5”, 6” and 8”wafer capability . 

Matrix is a Registered Trademark of Matrix Integrated Systems, Inc.Matrix 10 provides high throughput in a single wafer system capable of handling wide variety of substrates, including round, square and ranging from 4” up to 8”. 

Gasonics  is a Registered Trademark of Novellus Corp.The Gasonics L3510 is a versatile downstream photoresist removal system,designed for clean, damage-free removal of the most difficult resist structures.Utilizing the production-proven L-Series platform, the L3510 has a wide process window due to its patented microwave plasma source.Programmable heating and process controls contribute to the systems’ unparalleled process flexibility.3”, 4”, 5”, 6” and 8”wafer capability.

TOK OPMA 1250 Plasma Asher
TOKYO OKA / TOK OPMA 1250 Plasma Asher.

The LFE PDS/PDE 301 is a barrel plasma etcher that uses oxygen to etch organic films and residues such as photoresist in a process commonly referred to as "de-scumming.

Genesis Microstar 200C Single Wafer Processing System, 8"

- Single Wafer Processing System
- Up to 8 inch wafer
- Robot wafer transfer
- Include manual

Used DRYTEK  MEGASTRIP 6  H.F. Photoresist Stripper. Features a large capacity, aluminum chamber that processes up to 25 - 8 in. wafers, 50 - 6 in. wafers, 75 - 5 in. wafers, 100 - 3 in. or 4 in. wafers.

AE 2001 is a single wafer downstream isotropic etch system, designed to etch thin films such as poly silicon, silicon nitride and CVD oxides.Utilizing the proven Aura downstream microwave source and a dedicated reactor chamber,

Matrix is a Registered Trademark of Matrix Integrated Systems, Inc.The model 303 is an electro-mechanical production system used to etch materials such as nitride, oxide poly-silicon etc. from the surface of silicon or other substrate. Each wafer is processed individually by means a chemical reaction induced by a gas plasma.

Tegal 900 series Plasma/RIE etch System are used by the Semiconductor Industry for integrated circuit fabrication. The system are used in one part of the sequence of manufacturing steps that transfer a pattern formed from a layer of photosensitive material, the photoresist, to a layer that makes up a permanent part of the final device.

Lam 4420B, 8 inch wafer