• "Non-contact chuck method" which contacts only 3-4mm of the wafer edge (Contact chuck method also available)
• Integrated electrostatic eliminator
• Displays error messages with a LCD panel and work monitor
• Wafer ID management system (OCR/BCR/BCP) (optional)
• Safety Regulation SEMI S2 compliance
• SECS-I/II communication function (optional)

Alcatel 601E DRIE tool ,Used,6 inch configuration

Manufacturer: STS Cluster ICP

Model:Cluster 2 ASE

Condition:Used, AS IS(Refurbished system is optional)

For manual bake applications, the SITE MBO-T (with timer)reduces labor costs, improves the quality of your research and/or increases product yield.

Sold out

Perfect Soldering / RTA Systems

 • Max. 450ºC, ± 0,2ºK
  • Flux less / solder paste / void free soldering
  • Laser / RF / power die attachment
  • Package lid sealing
  • Rapid Thermal Photo sensitive BCB curing
  • AuGe / SiAu alloying, Rapid Thermal Annealing
  • Thermo compression wafer bonding
  • Wafer bump reflow, flip chip soldering
  • Popcorn effect analyzing
  • Rapid ramping: > 200ºC/min.
     on top of the quarz lamp heated
     Al plate, > 20ºC/second with direct IR single
     wafer heating, ramp down:
     ~100ºC/minute with Al Plate and
     <20ºC/second without Al plate
     Ramp rates and hold cycles free
     programmable, precisely controlled
  • Heated areas:
    147 x 217, 230 x 217
    310 x 240, 450 x 450 mm

AccuThermo AW 810M is a desktop rapid thermal processor for 5 to 8 inch wafer , which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity advanced temperature control technology and AW 900 new software, provide significant advantages over conventional furnace processing and conventional RTP systems. 

AccuThermo AW 610 is a desktop rapid thermal processor for 2 to 6 inch wafer, which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity advanced temperature control technology and AW 900 new software, provide significant advantages over conventional furnace processing and conventional RTP systems. 

AccuThermo AW 410 is a desktop rapid thermal processor for 2 to 4 inch wafer ,which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity advanced temperature control technology and AW 900 new software, provide significant advantages over conventional furnace processing and conventional RTP systems

AG Associates Heatpulse 610I Rapid Thermal Process,Rapid Thermal Processing,Rapid Thermal Annealing,Rapid Thermal Anneal system.

AG Associates Heatpulse 610 I can be for 2 to 4 or 4 to 6 inch wafer for 100 to 1250 C.

Condition:Fully refurbished and upgraded

Price:contact us by sales@allwin21,com

AG Heatpulse 610 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity,  provide significant advantages over conventional furnace processing and conventional RTP systems.

AG Heatpulse 410 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity,  provide significant advantages over conventional furnace processing and conventional RTP systems.

AG Heatpulse 210 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity,  provide significant advantages over conventional furnace processing and conventional RTP systems.

The tool for Rapid Thermal Process is Peak ALP 5000 (Peak 8500).The Peak Rapid Thermal Processor or RTP System heats substrates with its SP35X lamp,which sits at top the chamber.Gases can be introduced  into the process chamber ,and with the vacuum option,the pressure within the process chamber can be lowered and raised.Wafers are moved into and out of the process chamber by the system.

The results of experiments performed to evaluate the use of a commercially available rapid thermal annealer (RTA) with a graphite susceptor for capless rapid thermal annealing to activate implants in GaAs are reported in many articles. The interior of the susceptor was easily charged with As by annealing a sacrificial GaAs wafer.

1 OVEN-Control
2 ZERO-crossing
3 Timer-Counter
4 RMS Analog Card
5 STD Interface Card
6 MIO-24-I/O
7 A/D-D/A

Matrix is a Registered Trademark of Matrix Integrated Systems, Inc.Matrix 105 provides high throughput in a single wafer system capable of  handling wide variety of substrates, including round, square and ranging from 3” up to 6”. By maintaining independent closed-loop system controls, the system optimizes vital device parameters. 

Gasonics  is a Registered Trademark of Novellus Corp.GaSonic Aura 1000 Plasma System is the microprocessor controlled down-stream, or  “ afterglow” photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute. The unit is fully automated, cassette-to-cassette, and is a single-wafer process design.  

The Branson IPC 3000 is a barrel plasma etcher that uses oxygen to etch organic films and residues such as photoresist in a process commonly referred to as "de-scumming." During a normal run for the Branson Barrel Etcher, the chamber is evacuated to under 0.5 torr pressure.

Gasonics  is a Registered Trademark of Novellus Corp. Gasonics Aura 2000LL is a 8" Cassette to Cassette ,Single Wafer Downstream Microwave Asher w/ Loadlock with microwave source and a dictated reactor chamber ,8" Cassette to Cassette ,Single Wafer Asher ,Configured for 4" - 8" wafers,Loadlock with cool-down station for processed wafer Gas box,

Matrix is a Registered Trademark of Matrix Integrated Systems, Inc.Matrix 10 provides high throughput in a single wafer system capable of handling wide variety of substrates, including round, square and ranging from 4” up to 8”. 

Branson/IPC  L3200 single wafer downstream stripper,Dual quartz chambers for 100-150mm wafers( or 150-200mm wafers), cassette to casette operation

Aura 3010.The Aura 3010(Aura3000) is a single-wafer downstream photoresist asher, delivers high ash rates with low damage, a large process window, and a choice of process temperatures during the ashing process. The system has a user friendly menu-driven user interface, and is suitable for automation via SMIF (Standard Mechanical Interface) or AGV (Automated Guided Vehicle).3”, 4”, 5”, 6” and 8”wafer capability . 

Gasonics  is a Registered Trademark of Novellus Corp.The Gasonics L3510 is a versatile downstream photoresist removal system,designed for clean, damage-free removal of the most difficult resist structures.Utilizing the production-proven L-Series platform, the L3510 has a wide process window due to its patented microwave plasma source.Programmable heating and process controls contribute to the systems’ unparalleled process flexibility.3”, 4”, 5”, 6” and 8”wafer capability.

TOK OPMA 1250 Plasma Asher
TOKYO OKA / TOK OPMA 1250 Plasma Asher.