Allwin21 Corp. was formed in 2000 to provide  Rapid Thermal Process, Plasma Asher Stripper Descum, Plasma Etch/RIE/ICP,Sputtering and Evaporator System,Metrology and Tester  high-tech equipment, services and technical support in Semiconductor industry,MEMS, Biomedical, Nanotechnology,Solar,LEDs etc.. Located in Santa Clara, the heart of Silicon Valley, Allwin21 has been providing unique technical support, high quality equipment and fast supplied spare parts worldwide. We have maintained a global presence that has grown and expanded. into the major high-tech  manufacturing areas of the world. We pride ourselves on developing lasting customer and client relationships.Allwin21  is proud to announce it is certified as ISO 9001:2008 compliant organizations.

Allwin21 is the exclusive licensed manufacturer of   AG Heatpulse 610  Rapid Thermal Processor.  Allwin21 is manufacturing the AccuThermo AW 410,AccuThermo AW 610,AccuThermo AW 810,AccuTherm AW 820,AccuThermo AW 830  AtmosPress Rapid Thermal Processors and  AccuThermo AW 610V,AccuThermo AW 820V,AccuThermo AW 860V  vacuum Rapid Thermo Processors.Compared with traditional RTP system, Allwin21"s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies.    

KEY FEATURES

1. Closed-loop temperature control with pyrometer or thermocouple temperature sensing.
2. Precise time-temperature profiles tailored to suit specific process requirements.
3. Fast heating and cooling rates unobtainable in conventional technologies.
4. Consistent wafer-to-wafer process cycle repeatability.
5. Elimination of external contamination.
6. Small footprint and energy efficiency.
7. The watchdog timer shuts down the lamps to prevent run-away heating of the wafer.

Allwin21 is remanufacturing The AccuSputter ® AW 4450-Series Production Sputtering Systems, originally Perkin Elmer 4450 sputter systems,with  innovative software  with advanced controll technologies and  new design for much better performance and maintenance.The AccuSputter ® AW 4450-Series Production Sputtering Systems are manufactured in the configuration of a manually-loaded system capable of fully automatic operation. The AccuSputter ® AW 4450 sputtering head is equipped with three DeltaTM cathode or four round 8-inch positions ( Mo flame sprayed shields and shutters standard).
The AccuSputter ® AW 4450-Series Production Sputtering Systems deposit a wide variety of materials onto substrates such as ceramic, metal, plastics, glass and semiconductors. The system can also be used for RF sputter-etching, a process in which material is removed from, rather than being deposited on, the substrates prior to sputter deposition.These sputtering systems sequentially deposit thin films of up to three or four different materials onto a single substrate, thus attaining sandwich-structured films such as multi-layer optical interference filters or semiconductor devices. Resulting thin films range in thickness from a few Angstroms up to several microns.

Download AccuSputter® AW 4450 Brochure

Description of Features:

• Advanced AccuSputter ®AW4450 Controller with GUI mounted in the main frame;
• Manual, Semi and Automatic one button operation;
• Customer programming of recipe for process parameters.
• GEM/SEC II functions (Optional)
• 24V DC control components
• DC Gear Motors for table rotate and carriage moving;
• Advanced vacuum gauges and control system;
• MFC gas control system;
• Advanced RF automatically matching network;
• DC and RF power are mounted in the main frame;
• Fast Cycle Load Lock Operation ;
• High rate DeltaTM DC magnetron sputtering;
• High throughput operation: Automated load lock and controller sequences provide for efficient pump down and pallet transfer to process chamber
• High uniformity: ±7% deposition uniformity guaranteed with water-cooled rotating annular substrate table; ±5% achievable.
• Ultra-clean vacuum: Cryopumped and Meissner-trapped process chamber ensures contamination-free conditions especially important for critical processes such as the deposition of aluminum and platinum;
• Easy maintenance: Removable deposition shields permit easy system cleaning. Automatic cryopump regeneration minimizes downtime and inconvenience;
• Specialized pallets for ease of substrate leading/unloading;
• "Drop in" target for quick target changes, no screw to both with;
• "Snap-out" deposition shields for quick, easy maintenance;
• Fail-safe system protection